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MBA, Ph.D in Management
Harvard university
Feb-1997 - Aug-2003
Professor
Strayer University
Jan-2007 - Present
You are called as an expert witness to analyze the fracture of a sintered
silicon carbide plate that was fractured in bending when a blunt load was applied to the plate
center. Measurement of the distance between the fracture origin and the mirror/mist boundary
on the fracture surface gives a radius of 0.796 mm. You are given three pieces of the same SiC
to test, and you determine that the mirror radius is 0.603, 0.203, and 0.162 mm for bending
failure stress levels of 225, 368, and 442 MPa, respectively. What is your estimate of the
stress present at the time of fracture for the original plate?
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