Maurice Tutor

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About Maurice Tutor

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Expertise:
Algebra,Applied Sciences See all
Algebra,Applied Sciences,Biology,Calculus,Chemistry,Economics,English,Essay writing,Geography,Geology,Health & Medical,Physics,Science Hide all
Teaching Since: May 2017
Last Sign in: 408 Weeks Ago, 1 Day Ago
Questions Answered: 66690
Tutorials Posted: 66688

Education

  • MCS,PHD
    Argosy University/ Phoniex University/
    Nov-2005 - Oct-2011

Experience

  • Professor
    Phoniex University
    Oct-2001 - Nov-2016

Category > Management Posted 03 Oct 2017 My Price 6.00

large scale integration

10.14   Advances in very large scale integration (VLSI) of elec- tronic devices on a chip are often restricted by the abil- ity to cool the chip. For mainframe computers, an array of several hundred chips, each of area 25 mm2, may be mounted on a ceramic substrate. A method of cooling the array is by immersion in a low boiling point fluid such as refrigerant R-134a. At 1 atm and 247 K, proper-

ties of the saturated liquid are µ, = 1.46 X 10-4  N · s/m2,

cp = 1551 J/kg · K, and Pr = 3.2. Assume values of

Cs, f = 0.004 and n = 1.7.

(a)    Estimate the power dissipated by a single chip if it is operating at 50% of the critical heat flux. What is the corresponding value of the chip temperature?

Compute and plot the chip temperature as a function of surface heat flux for 0.25 qs"/q"max   0.90.

Answers

Maurice Tutor
(5)
Status NEW Posted 03 Oct 2017 11:10 PM My Price 6.00

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