Maurice Tutor

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    Argosy University/ Phoniex University/
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Category > Management Posted 12 Nov 2017 My Price 5.00

chemical etching of silicon wafers

Yashchin (1995) discusses a process for the chemical etching of silicon wafers used in integrated circuits. This process etches the layer of silicon dioxide until the layer of metal beneath is reached. This company monitors the thickness of the silicon dioxide layers because thicker layers require longer etching times. The layer has a target thickness of 1 micron and a historical standard deviation of 0.06 micron. The company uses subgroups of four wafers. The mean thicknesses for 40 subgroups follow. The data are in consecutive order, reading across the rows. The first observation is 1.006, the second is 1.037, and so on.

Calculate the appropriate control limits and plot the control chart. Comment on your results.

 

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Maurice Tutor
(5)
Status NEW Posted 12 Nov 2017 01:11 PM My Price 5.00

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