Maurice Tutor

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    Argosy University/ Phoniex University/
    Nov-2005 - Oct-2011

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Category > Management Posted 20 Nov 2017 My Price 6.00

process for the chemical etching

Yashchin (1995) discusses a process for the chemical etching of silicon wafers used in integrated circuits. This process etches the layer of silicon dioxide until the layer of metal beneath is reached. This company monitors the thickness of the silicon oxide layer because thicker layers require longer etching times. Historically, the layer thicknesses have a standard deviation of 0.06 micron.

a. A recent random sample of four wafers yielded a sample mean of 1.134 microns. Construct a 95% confidence interval for the true mean thickness.

b. Find the sample size required to estimate the true mean thickness to within 10.01 micron using a 95% confidence interval.

c. What did you assume to do these analyses? How can you check these assumptions?

 

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Maurice Tutor
(5)
Status NEW Posted 20 Nov 2017 12:11 PM My Price 6.00

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