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| Teaching Since: | May 2017 |
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MCS,PHD
Argosy University/ Phoniex University/
Nov-2005 - Oct-2011
Professor
Phoniex University
Oct-2001 - Nov-2016
Micro channel compact heat exchangers can be used to cool high heat flux microelectronic devices. The accompanying sketch on the next page shows a schematic view of a typical micro channel heat sink. Micro fabrication
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techniques can be used to mass produce aluminum channels and fins with the following dimensions:

Assuming that there are a total of 100 fins and that water at 30°C is used as the cooling medium at a Reynolds number of 2000, estimate: (a) the water flow rate through all the channels, (b) the Nusselt number, (c) the heat transfer coefficient, (d) the effective thermal resistance between the IC elements forming the heat source and the cooling water, and (e) the rate of heat dissipation allowable if the temperature difference between the source and the water is not to exceed 100 K.
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