Maurice Tutor

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Teaching Since: May 2017
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  • MCS,PHD
    Argosy University/ Phoniex University/
    Nov-2005 - Oct-2011

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  • Professor
    Phoniex University
    Oct-2001 - Nov-2016

Category > Management Posted 17 Feb 2018 My Price 9.00

heat flux as a function

In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature T0, a radiant source is used to provide a heat flux  all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at T∞ and a convection heat transfer coefficient h.

 

(a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form.

(c) Compute and plot the required heat flux as a function of the film thickness for 0 ≤  Lƒ  ≤ 1 mm. (d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine the heat flux required to achieve bonding. Plot your results as a function of Lƒ for 0 ≤  Lƒ  ≤ 1 mm.

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Maurice Tutor
(5)
Status NEW Posted 17 Feb 2018 10:02 PM My Price 9.00

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