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MCS,PHD
Argosy University/ Phoniex University/
Nov-2005 - Oct-2011
Professor
Phoniex University
Oct-2001 - Nov-2016
Advances in very large scale integration (VLSI) of electronic devices on a chip are often restricted by the ability to cool the chip. For mainframe computers, an array of several hundred chips, each of area 25 mm2, may be mounted on a ceramic substrate. A method of cooling the array is by immersion in a low boiling point fluid such as refrigerant R-134a. At 1 atm and 247 K, properties of the saturated liquid are   Assume values of Cs, f = 0.004 and n = 1.7.
Â
(a) Estimate the power dissipated by a single chip if it is operating at 50% of the critical heat flux. What is the corresponding value of the chip temperature?
(b) Compute and plot the chip temperature as a function of surface heat flux for
Â
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