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Elementary,Middle School,High School,College,University,PHD
| Teaching Since: | May 2017 |
| Last Sign in: | 408 Weeks Ago, 2 Days Ago |
| Questions Answered: | 66690 |
| Tutorials Posted: | 66688 |
MCS,PHD
Argosy University/ Phoniex University/
Nov-2005 - Oct-2011
Professor
Phoniex University
Oct-2001 - Nov-2016
An array of power transistors dissipating a total of 25 W is to be cooled by mounting them on a 50-mm by 50-mm square aluminum plate. It can be assumed that the back side of the plate is insulated. While air surrounding the package is at 270C, the surface of the plate is not to exceed 770C for normal operation. You are to explore various mechanisms and design feasible solutions to satisfy this temperature requirement. Perform a quick calculation to justify disregarding the radiation. You may consider free versus forced convection, changing surface orientation and adding one or more fins. Discuss various design options considered and justify your final selection(s). Consider criteria such as cost, manufacturability, safety, reliability etc. at least qualitatively. Rank the feasible solutions in your conclusion of the report.
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