Maurice Tutor

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Category > Computer Science Posted 15 Jul 2017 My Price 5.00

silicon chip is encapsulated

A silicon chip is encapsulated such that, under steadystate conditions, all of the power it dissipates is transferred by convection to a fluid stream for which h = 1000 W/m2 . K. and T∞ = 25°C. The chip is separated from the fluid by a 2-mmthick aluminum cover plate, and the contact resistance of the chip/aluminum interface is 0.5 × 10-4 m2 . K/W.

If the chip surface area is 100 mm2 and its maximum allowable temperature is 85°C, what is the maximum allowable power dissipation in the chip?

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Maurice Tutor
(5)
Status NEW Posted 15 Jul 2017 09:07 PM My Price 5.00

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