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Elementary,Middle School,High School,College,University,PHD
| Teaching Since: | May 2017 |
| Last Sign in: | 398 Weeks Ago, 3 Days Ago |
| Questions Answered: | 66690 |
| Tutorials Posted: | 66688 |
MCS,PHD
Argosy University/ Phoniex University/
Nov-2005 - Oct-2011
Professor
Phoniex University
Oct-2001 - Nov-2016
To enhance heat transfer from a silicon chip of width W = 4 mm on a side, a copper pin fin is brazed to the surface of the chip as shown in Fig. P17.34. The pin length and diameter are L = 12 mm and D = 2 mm, respectively, and atmospheric air at u∞ = 10 m/s and T = 300 K is in cross flow over the pin. The surface of the chip, and hence the base of the pin, are maintained at a temperature of Tb = 350 K.

(a) Assuming the chip to have a negligible effect on flow over the pin, what is the average convection coefficient for the surface of the pin?
(b) Neglecting radiation and assuming the convection coefficient at the pin tip to equal that calculated in part (a), determine the pin heat transfer rate.
(c) Neglecting radiation and assuming the convection coefficient at the exposed chip surface to equal that calculated in part (a), determine the total rate of heat transfer from the chip.
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